Turnkey Package Options

embedded brains offers turnkey packages for many popular space grade Systems On Chip and board level platforms.

These packages are available in three different types, depending on your requirements: SDK Basic, SDK Qualifiable and QDP.

Package Overview

SDK Basic

The fast-track solution for development and prototyping.

SDK Basic provides the full RTEMS feature set, including the RTEMS source code, development tools, a Board Support Package (BSP), drivers—pre-configured, tested, and ready for immediate use on your hardware. Ideal for non-critical applications, rapid prototyping, or development cycles where ECSS compliance is not required. Cost-effective, flexible, and designed for minimal setup effort.

SDK Qualifiable

The foundation for ECSS-compliant systems.

SDK Qualifiable reduces RTEMS and driver complexity to components suitable for qualification, for projects aiming for ECSS compliance. It is not yet prequalified but serves as the technical baseline for applications which may need a qualified RTOS in future. SDK Qualifiable can be upgraded to a full, prequalified QDP later.

Qualification Data Package (QDP)

Full prequalification for ECSS-compliant applications.

The QDP combines SDK Qualifiable with complete prequalification documentation, traceability matrices, and compliance evidence. It is the recommended package for projects requiring ECSS qualification, such as space missions or high-reliability systems. Includes all documentation and tools required for audits and formal approvals.

Features Common for all Packages

RTEMS Core:

Includes the RTEMS operating system (full or reduced feature set, depending on package).

Board-Specific Software:

Bootloader, initialization, and device drivers (standard or prequalification-ready).

Development Tools:

Binutils, GCC Compiler, GDB Debugger, QEMU Simulator, Trace Compass.

Basic Documentation:

Integration and maintenance documentation (scope varies by package).

Expert Support:

Technical support for setup, debugging, and customization (scope varies by package).

Key Differences between Packages

SDK BasicSDK QualifiableQualification Data Package (QDP)
PurposeRapid development, prototyping, and non-critical applications which will not need qualificationFunctional Prototyping and Development for safety critical systems, which may need qualification in the futureDevelopment for safety critical systems targeting formal ECSS qualification
RTEMS CoreFull feature set.Reduced to qualifiable functions and components.Reduced to qualifiable functions and components.
Device DriversStandard drivers.Drivers with reduced complexity (some alternative codebases).Same as SDK Qualifiable, plus prequalification reports.
Qualification ToolsNot included.Not included.Included (traceability matrices, compliance reports, qualification support tools).
DocumentationStandard integration / maintenance docs.Basic docs (no qualification data).Full pre-qualification documentation with approx. 50 documents

Package Details

SDK Basic – Full Flexibility for Development and Prototyping

SDK Basic is the all-in-one solution for developers needing a quick and ECSS-compliance-free RTEMS deployment. It includes:

  • Full RTEMS feature set with Board Support Package (BSP), bootloader, initialization, and standard device drivers.
  • Development tools: GCC Compiler, GDB Debugger, QEMU Simulator, and Binutils for efficient software development.
  • Standard documentation for integration, maintenance, and customization—ideal for teams without ECSS requirements.
  • Fast delivery and low-cost implementation, as no pre-qualification steps are needed.
  • Use Cases: Prototyping, research, non-safety-critical embedded systems, evaluation boards.

Advantage: Maximum flexibility with minimal effort—perfect for projects where speed and cost efficiency are priorities.

SDK Qualifiable – The Baseline for ECSS-Compliant Systems

SDK Qualifiable is designed for projects that will require ECSS pre-qualification later but do not yet need full tests and documentation. It includes:

  • Reduced feature set: RTEMS core and drivers limited to components suitable for pre-qualification to lower complexity for future pre-qualification.
  • Adapted drivers: Some drivers use alternative codebases optimized for validation processes.
  • Basic documentation (without pre-qualification evidence)—serves as the technical foundation for later pre-qualification steps.
  • No pre-qualification tools included (these are part of the QDP).
  • Use Cases: Preparation for ECSS compliance, systems with moderate reliability requirements, pre-stages for prequalified products.

Advantage: Saves time and costs during the preparation phase for ECSS prequalification without requiring full documentation upfront. Can be upgraded to full QDP when required.

Qualification Data Package (QDP) – Complete Pre-qualification for ECSS-Compliant Applications

The QDP is the complete solution for projects requiring ECSS pre-qualification. It includes:

  • SDK Qualifiable as the technical baseline plus full prequalification documentation:
    • Traceability matrices
    • compliance reports
  • Pre-qualification reports for audits, such as traceability verification and requirements validation reports.
  • Comprehensive time budget to support for the pre-qualification process, including ECSS compliance consulting.
  • Use Cases: Space missions, high-reliability systems, and applications requiring formal ECSS compliance.

Advantage: “Out-of-the-box” pre-qualification package – saves months of preparation and significantly reduces risks during formal approvals.

FAQ

Answer:

In theory, yes—but in practice, it’s not economical and sometimes impossible.The challenge is the complexity of the full RTEMS codebase and many device drivers, which often make validation and verification processes extremely time-consuming or even impractical.
For projects requiring certification or qualification, we recommend our SDK Qualifiable and Qualification Data Packages (QDP). These versions use reduced feature sets specifically designed to meet certification requirements efficiently.

Answer:

The full RTEMS feature set—including many device drivers—cannot always be qualified due to internal complexity or context-dependent system behaviour in safety-critical environments.
To address this, our SDK Qualifiable provides a streamlined feature set, carefully selected to meet certification requirements:

  • The RTEMS core is limited to qualifiable components.
  • Device drivers are either adapted or replaced with versions designed for qualification.
  • Some drivers use alternative code bases specifically developed for this purpose.

This facilitates qualification while maintaining reliability and performance.

Answer:

No, as the code is not verified and validated yet to the required quality level. However, the API is identical, so you can start applications software development on this basis.

Answer:

Indeed, this package is useful only in conjunction with a qualification process. However, due to its rather swift availability and low cost it can be used for application software development before or concurrently to the qualification process. This saves time and reduces the risks of qualifying a BSP that is still object to change.

Answer:

It’s the same as for SDK Basic: All code is free to use without restrictions, except some specifically marked drivers that apply proprietary IPs or a restrictive license scheme.

Answer:

This is a specifically tailored version, and most peripherals (e.g. the device drivers) have been designed for the purpose of qualification. So, in a sense, this saves cost for a later qualification (which otherwise would require much more effort, if feasible at all).

Table of supported SoCs and Boards

Board (Chip)
Manufacturer
Board (SoC)SDK BasicSDK QualifiableQDP
fentISSXtratuM / XNG Hypervisor23on demand(YES +)on demand
AMD XilinxZC702 (Zynq XC7Z020)YESYESYES
AMD XilinxZCU104 (UltraScale+ ZU7EV)YESYESYES
AMD XilinxVersal Adaptive SoCYESYESYES
GaislerGR712RCYESNOYES(public)
GaislerGR716A and GR716Bon demandon demandon demand
GaislerGR740YESNOYES(public)
GaislerGR765YESon demandon demand
GaislerNoel-VYESon demandon demand
GaislerUT699/UT699E/UT700YESon demandon demand
MicrochipIcicle (PolarFire MPFS250T-FCVG484E)YESon demandon demand
MicrochipSAMRH707 – Radiation HardnessYESon demandon demand
MicrochipSAMRH71F20-EK (SAMRH71F20)YESon demandon demand
MicrochipSAMV71Q21RT – Radiation ToleranceYESon demandon demand
MicrochipSAM V, SAM E & SAM S MCUsYESon demandon demand
NanoXploreNG-ULTRAYESon demandon demand
TeledyneLS1046-SpaceYESYESon demand
NXPFreeway-LS1046A (LS1046A)YESYESon demand
TeledyneQorIQ P-Series and QorIQ T-SeriesYESYESon demand
Texas InstrumentsTMS570LC4357, TMS570LS3137YESon demandon demand
VoragoVA 41600on demandon demandon demand
VoragoVA 41620on demandon demandon demand
VoragoVA 41628on demandon demandon demand
VoragoVA 41629on demandon demandon demand
VoragoVA 41630on demandon demandon demand
DSIOBC (LEON-3FT dual core)on demandon demandon demand
ZINSBCFA1000 (SAMRH71)on demandon demandon demand
Xiphos (AMD Xilinx)Xiphos Q7 (Zynq-7000)YESYESon demand
Xiphos (AMD Xilinx)Q8 (Zynq-Ultrascale+)on demandon demandon demand